Fast heat dissipation pad garnet 1mmT thermal conductive silicone gap pad TIF140-31E for IC component
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
The TIF140-31E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 1.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
>Moldability for complex parts
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat pipe thermal solutions
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> mainboard/mother board
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
| Typical Properties of TIF140-31E Series |
| Color | Garnet | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
| Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.36 |
| 20mils / 0.508 mm | 0.41 |
| Specific Gravity | 2.75 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.47 |
| 40mils / 1.016 mm | 0.52 |
| Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.58 |
| 60mils / 1.524 mm | 0.65 |
| Hardness | 35 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.72 |
| 80mils / 2.032 mm | 0.79 |
| Tensile Strength | 45 psi | ASTM D412 | 90mils / 2.286 mm | 0.87 |
| 100mils / 2.540 mm | 0.94 |
| Continuos Use Temp | -50 to 200℃ | *** | 110mils / 2.794 mm | 1.01 |
| 120mils / 3.048 mm | 1.09 |
| Dielectric Breakdown Voltage | >10000 VAC | ASTM D149 | 130mils / 3.302mm | 1.17 |
| 140mils / 3.556 mm | 1.24 |
| Dielectric Constant | 5.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.34 |
| 160mils / 4.064 mm | 1.42 |
| Volume Resistivity | 7.8X10" Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.50 |
| 180mils / 4.572 mm | 1.60 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.68 |
| 200mils / 5.080 mm | 1.77 |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
,
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
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Fast Heat Dissipation Pad Garnet 1mmT Thermal Conductive Silicone Gap Pad TIF140-31E For IC Component Images
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